CONFERENCE KEYNOTES:

5 NOVEMBER, 2008, WEDNESDAY

08:45 AM – 09:15 AM

1.    Engineering in the Era of Consumer Driven Markets.

                        Instructor :        Dr. Bill Chen
                                                IEEE CPMT President

09:15 AM – 10:00 AM

2.    Interdependency Of Packaging, Reliability And Failure Analysis In Solving Future Packaging Challenge. 

                        Instructor :        Raj Master
                                                Advanced Micro Devices (AMD), USA

10:00AM – 10:45AM

3.    Future Trends in Reliability Technology in Electronics. 

                        Instructor :        Dr. Mervi Poulasto-Kröckel
                                                Infineon Technology, GERMANY

13:40 PM – 14:25 PM

4.    Technology Trends for Heterogeneous Integration. 

                        Instructor :        Dr. Rolf Aschenbrenner
                                                Fraunhofer Institute, IZM

6 NOVEMBER, 2008, THURSDAY

08:30 AM – 09:15 AM

5.    A Vision Of The Future Of Packaging & Assembly Technology. 

                        Instructor :        Dr. Karl Johnson
                                                Freescale Semiconductor, USA

14:00 PM – 14:45 PM

6.    Opportunities in Microelectronic Packaging, Challenges & the Need For Innovation.

            Instructor :        YK Sow
                                    Intel Technology, MALAYSIA

SHORT COURSE ON 4^th NOVEMBER 2008 (1 FULL DAY)

MORNING SHORT COURSE (8:15 AM – 12:15 PM)

1.                Thermal Management of IC Packages Part I. 

                        Instructor :        Prof. Dr. Kankanhalli Seetharamu
                                                PES Institute of Technology, INDIA

2.         Through Silicon Vias And Microvias For High Density Interconnect in Advanced Packaging. 

                        Instructor :        Prof. Dr. Ricky Lee
                                                Hong Kong University of Science and Technology, HONG KONG

3.         Wafer Level Chip Scale Packaging Part I. 

                        Instructor :        Luu Nguyen
                                                National Semiconductor Corporation, USA

AFTERNOON SHORT COURSE (1:30 PM – 5:30 PM)

1.        Thermal Management of IC Packages Part II.

                        Instructor :        Prof. Dr. Kankanhalli Seetharamu
                                                PES Institute of Technology, INDIA

2.         3D Packaging Technology And Advances. 

                        Instructor :        Shimamoto Haruo
                                                Renesas Technology Corporation, JAPAN 

3.         Wafer Level Chip Scale Packaging Part II. 

                        Instructor :        Luu Nguyen
                                                National Semiconductor Corporation, USA